Accession Number : ADB215674


Title :   Affordable, Lightweight, Highly Conductive Polymer Composite Electronic Packaging Structures


Descriptive Note : Final rept. Apr 1995-Feb 1996


Corporate Author : COMPOSITE OPTICS INC SAN DIEGO CA


Full Text : http://www.dtic.mil/get-tr-doc/pdf?AD=ADB215674


Report Date : JUN 1996


Pagination or Media Count : 47


Abstract : The objective of this proposed SBlR research project is to develop the technology which will enable the production of affordable, lightweight, highly conductive polymer composite electronic packaging (i.e., electronic housings and heat sinks). The research will center on predominately polymer matrix composite materials and how various material designs can be utilized in various structural/thermal configurations to produce electronic housings and heat sinks that exceed the performance requirements of current aluminum electronic housings and metallic heat sinks (and at one-half the weight). The applications of this technology are very suited to commercial satellites as well as aircraft avionics, and shipboard and field electronic packaging. This technology has the capability of displacing aluminum for thermal/structural applications.


Descriptors :   *POLYMERS , *COMPOSITE MATERIALS , *PACKAGING , THERMAL PROPERTIES , STRUCTURAL PROPERTIES , ELECTRONIC EQUIPMENT , MATRIX MATERIALS , HOUSINGS , HEAT SINKS.


Subject Categories : LAMINATES AND COMPOSITE MATERIALS
      CONTAINERS AND PACKAGING


Distribution Statement : APPROVED FOR PUBLIC RELEASE