Accession Number : ADA096254
Title : The Effects of Reduced Atmospheric Pressure on Thermal Contact Resistance and Electronic Component Forced Air Film Coefficients
Descriptive Note : Technical rept.
Corporate Author : NAVAL WEAPONS SUPPORT CENTER CRANE IN
Personal Author(s) : Lannan, Ronald B. ; Evans, Robert
Full Text : http://www.dtic.mil/get-tr-doc/pdf?AD=ADA096254
Report Date : 15 AUG 1980
Pagination or Media Count : 70
Abstract : This report summarizes the theoretical and empirical analysis performed to determine the effects of reduced atmospheric pressure (for altitudes up to 70,000 feet) on conduction and convection thermal interfaces encountered in unpressurized avionics electronic equipment bays. For the purpose of this report, the conduction thermal interface of the Improved Standard Electronic Module (ISEM) was selected for study, although the empirical results and theoretical approach revealed herein can be applied to similar conduction interfaces on other electronic modules. The results of the effects of reduced atmospheric pressure on forced-air film coefficients can be applied generally to forced-air cooling of most electronic equipment.
Descriptors : *ELECTRONIC EQUIPMENT , *MODULES(ELECTRONICS) , *FILMS , INTERFACES , THEORY , BAROMETRIC PRESSURE , AIR COOLED , THERMAL PROPERTIES , THERMAL RESISTANCE , STANDARDS , CONDUCTIVITY , EXPERIMENTAL DATA , CONVECTION
Subject Categories : ELECTRICAL AND ELECTRONIC EQUIPMENT
Distribution Statement : APPROVED FOR PUBLIC RELEASE